KIT - Institut für Mechanische Verfahrenstechnik und Mechanik - Forschung (AME) - Publikationen - Less is more: Enabling low-filled electrically conductive adhesives for shingled solar cell interconnection using the capillary suspension concept

Less is more: Enabling low-filled electrically conductive adhesives for shingled solar cell interconnection using the capillary suspension concept

Autor:
Kronsbein M., Böck L., Dyhr K., Rößler T., Willenbacher N.
Quelle:
Solar Energy Materials and Solar Cells, 2025, 287, 113603

https://www.scopus.com/inward/record.uri?eid=2-s2.0-105000974661&doi=10.1016%2fj.solmat.2025.113603&partnerID=40&md5=7cb7ef7eee6d18e69ed086f9a4d68908